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PostProcess® DEMI 800 Series
PostProcess® DEMI 800 Series
The DEMI 800 Series uses PostProcess’ Submersed Vortex Cavitation (SVC) technology for removing 3D-printed supports or the excess of resin after the additive manufacturing process. The DEMI systems are compatible with various 3D-printing technologies: Fused Deposition Modeling (FDM), Stereolithography (SLA), PolyJet, CLIP or Digital Light Processing (DLP). It is available in a variety of models based on your unique application needs.