Image shows DEMI 400, a post-process system for SLA and DLP resin removal by Post Process Technologies

PostProcess® DEMI 400™ Series

PostProcess® DEMI 400™ Series

DEMI 400 Series from PostProcess Technologies help you to further advance your additive manufacturing workflow. The DEMI leverages patented, software-driven Submersed Vortex Cavitation (SVC) technology and additive formulated chemistries to optimize support and resin removal processes. Benefits? From automation and less labour work, to higher quality of dental 3D-printed parts and overall cost savings, you can stay ahead of the competition.